Automated Multi-wavelength Laser Scribing / Ablation / Cutting Station

Automated Multi-wavelength Laser Scribing /
Ablation / Cutting Station

Model: HO-LSWS-300X

Precision optical assembly
Versatile laser system designed

The Holmarc Automated Multi-wavelength Laser Scribing / Ablation / Cutting Station with Micro Inspection Camera Model HO-LSWS300X is a versatile laser system designed for precision scribing, ablation, and cutting. It is a useful tool for creating narrower scribe lines compared to traditional mechanical methods. It is a non-contact process that minimizes micro-cracking and substrate damage. With high peak power and excellent beam quality lasers are used for scribing, resulting in cleaner lines and higher throughput. Laser scribing offers benefits such as clean scribing of hard or brittle materials, lower cost, less chipping and micro-cracking, narrower cut widths for more parts per wafer, and greater process tolerances for reliable manufacturing at low cost.

It features Precision optical assembly creating a minimum line width of 0.002 mm (Line width can be varied up to 0.5 mm using optics), precise repeatability (±0.002 mm), a red guidance laser, motorized focusing, and an integrated microscope. The closed-chamber design ensures safety, and it finds applications in microelectronics, photovoltaics, and MEMS fabrication.

Automated Multi-wavelength Laser Scribing / Ablation / Cutting Station
Scribing / Ablation / Cutting Area	200 x 200 mm, 150 x 150 mm & 100 x 100 mm (selectable)
Scribing / Cutting Method	Galvano based
Galvano speed limit	0 - 1500 mm / s
The minimum line width	0.01 mm
Repeatability	± 0.002 mm
Guidance Laser	Red
Focusing	Motorized stepper motor controlled Focusing
Travel Range	300 mm
Memory Focus button
Design	Closed Chamber
Gas inlet	Active assist gas purging option
Imaging / Inspection / Alignment	Yes

Telecentric Digital Inspection / Measuring Positioning Microscope
Equipment Type	Upright
Effective Magnification	1 X
Vision	Digital PC Based software measurements
Working Distance	40 mm
Working Throat	100 mm
Objective Design	Telecentric
Mount	C-Mount
Typical Distortion @ 588 nm	0.0083 %
Typical Telecentricity @ 588 nm	0.02°
Working Distance Tolerance	± 1 mm
Illumination for imaging	Top, Bottom & Co-Axial HB-LED Based
Illumination Control	Continuously Variable PC controlled

Sensor Type	Cooled CMOS
Array Diagonal	15.86 mm
Resolution	20MP, 5472(H) x 3648(V)
Pixel Size	2.4 μm x 2.4 μm
Effective Area	13.1 mm x 8.8 mm
Frame Rate	15fps @ 5472 x 3648
Exposure Time	18 μs - 15 s
Bit Depth	16 / 8 bit
Camera Size	68 x 68 x 46 mm
Data Interface	USB 3.0

Mapping Stage

Stage : Automatic XYZ stage with Z-axis Automated Focus Function

FOCUS and XY : Motorized servo motor controlled

Resolution : 1 Micron

Positioning Accuracy : 10 Micron with encoder

Scanning Speed : 40 mm / sec

Controller : HOLMARC XYZ Stepper controller Unit

532 / 1064 nm

Scribing / Ablation / Cutting Laser Specifications

532 nm and 1064 nm solid-state AOM Q-switched lasers have the features of high peak power, high repetition rate, and short pulse duration, which are used in scientific research, biology, instrumentation, 3D marking, laser marking, sub-surface engraving and so on.

Laser 1

532 nm LD PUMPED ALL-SOLID-STATE AOM Q-SWITCHED LASER

Wavelength (nm) : 532 ± 1

Operating mode : Acousto-Optic Q-switched

Average power (W) : 20W @ 50kHz

Average power (W) : Single pulse energy (mJ) * Rep. rate (kHz)

Single pulse energy (µJ) >400 uJ @ 50kHz

Rep. rate (kHz) 50~100

Pulse width (ns) ~11 @ 50 kHz

Transverse mode TEM00

Beam Circularity (%) >85

M2 factor <1.3

Warm-up time (minutes) <10

Beam divergence, full angle (mrad) <2

Beam diameter at the aperture (1/e2, mm) ~3

Beam height from base plate (mm) 91

Cooled method Water Cooled

Operating temperature : 10 ~ 35 (ºC)

Supply Voltage : 100 - 240 VAC or 24 VDC

Dimension : 640 * 260 * 124 mm

Laser 2

1064 nm LD PUMPED ALL-SOLID-STATE AOM Q-SWITCHED LASER

Wavelength (nm) : 1064 ± 1